Principal Packaging Engineer
Company: VirtualVocations
Location: Far Rockaway
Posted on: May 3, 2025
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Job Description:
A company is looking for a Principal Packaging Engineer who will
develop and refine Chip-on-Wafer-on-Substrate technology.
Key Responsibilities
Innovate and enhance CoWoS packaging processes to improve chip
performance, power efficiency, and reliability
Collaborate with design, test, and manufacturing teams for
effective chip-package integration
Lead failure analysis and drive yield improvements across packaging
processes
Required Qualifications
15 years of hands-on experience in advanced semiconductor packaging
and interconnect processes
Proven expertise in CoWoS / FOCoS, or FOWLP; familiarity with EMIB,
InFO, and advanced 2.5D/3D integration technologies is a plus
Strong knowledge of thermal management, reliability testing, and
signal/power integrity challenges
Experience working with TSMC and leading OSATs
Bachelor's or Master's degree in Electrical Engineering, Materials
Science, Mechanical Engineering, or a related field
Keywords: VirtualVocations, White Plains , Principal Packaging Engineer, Engineering , Far Rockaway, New York
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